Flux cleaning agent
A new environmentally friendly water-based cleaning agent for semiconductor packaging developed using our patented technology
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Keyword:
Liquid alkali, soda ash, caustic soda, sodium persulfate, PAC (polyaluminum chloride), PAM (polyacrylamide), sodium hypochlorite
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Flux cleaning agent
☆ A new environmentally friendly water-based cleaning agent for semiconductor packaging developed using our patented technology
☆ Breaking through the problems of low cleaning yield, unstable bonding, difficult rinsing, and environmental friendliness of traditional solvent cleaning agents
☆ It has good ability to remove various types of lead-free solder paste residue, solder paste residue, oil stains, fingerprints, metal oxide layers, electrostatic particles, and dust
☆ Suitable for high-precision, high-density, BGA, Flip chips and other soldering and packaging processes for clean cleaning
☆ Mild formula, odorless, strong cleaning power; It has excellent compatibility with various metal materials and auxiliary materials used in packaging
Physical and chemical parameters:
Colorless to pale yellow liquid
| Classification | Water based cleaning agent TBS-781 |
| Appearance | Colorless to pale yellow liquid |
| Density (23 ℃) g/cm³ | 1.0± 0.0.5 |
| pH value | Original solution: 7.5± 0.5 Mixing water: 9.0+ 0.5 |
| Boiling range | 100-235/212-455 |
| Flash point | None |
| Cleaning temperature | 45℃-55℃ |
| Halogen | 0 |
| Water solubility | Soluble |
| Application solubility | Used for mixing water |
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